Quantcast FI.AG-TYPF CONNFCTOR
Share on Google+Share on FacebookShare on LinkedInShare on TwitterShare on DiggShare on Stumble Upon
TM 10-3930-664-24 E. FI.AG-TYPF CONNFCTOR 1. DISASSEMBLE.      Cut   wire   close   to   terminal. Remove and discard terminal. 2. ASSEMBLE. a. Strip wire.  Use care not to nick or cut wire strands. NOTE If  solid  core  solder  is   used   to   coat wires,   bare   wires   must   be   cleaned with flux before tinning. b. Tin  bare  wire.    Use  rosin-core  solder  to coat bare wire. c. Roll   back   insulation   on   new   terminal   to expose crimping area. d. Insert   wires   into   new   terminal.      Crimp terminal to secure wire. e. Unroll  insulation  on  new  terminal  to  cover parts. F. RING-TYPE CONNECTOR, SOLDERED 1. DISASSEMBLE.      Cut   wire   close   to   terminal. Remove and discard terminal. 2. ASSEMBLE. a. Strip wire.  Use care not to nick or cut wire strands. NOTE If  solid  core  solder  is  used  to  coat  wires,  bare  wires  must  be  cleaned  with  flux before tinning. b. Tin bare wires.  Use rosin-core solder to coat bare wires. NOTE New terminal must match ring size of terminal with mounting screw at connection. New terminal wire solder area must match thickness of wire. c. Insert wires into new terminal.  Secure wire to prevent movement. 2-240

Integrated Publishing, Inc.